Product layer:Single, double, multi layer (maximum layers :16)

Material:  FR-4 ,CEM-1,CEM-3 ,HF board material, Halogen Free

Maximum size of finished single, double board :610 × 450mm

Maximum size of multi layer board:500 × 450mm

Thickness of rigid board :0.3 -3.2mm

Smallest metal aperture:0.2mm

Minimum wire width / spacing:  0.1mm /   0.1mm

Provided solder type:Ray solder or liquid sensitization solder

Language ink colors: White, black

The smallest character line diameter/  0.1mm

Thickness of lead plating:     

Hole wall thickness of plating copper thickness(Minimal  /Normal /Maximal ):15μm /25.4μm/50μm

Thickness of soldering tin:     (Min/Max) 2/ 30μm

Thickness of lead-tin:(Min/Max)  5/12μm

Thickness of nickel:(Min/Max)  3/5μm      

Thickness of Pin Nickel and plating gold:

Nickel layer:(Min/Max)  3/5μm          

Gold layer:(Min/Max)  0.05/1.0μm

Especial machine process      Pin angle :30 ° 45 ° 60 °/V groove ,U groove

Advanced Technologies: Blind/Buried Via, HDI Micro via

Surface Treatment: ENIG, OSP, Immersion Silver/Tin/Gold, Lead free HAL ,HAL,Gold plating

Certificates:  ISO9001 and UL

If you have any interesting in buying or agenting our products,please feel free to contact us via Gracepcb (at) gmail (dot) com.

Price: Quite competitive especially for orders in huge quantities

Products application: Computer, Communication, Test & Control system, Medical Equipment etc.

Lead Time: 5-20 days (Depends on Q'ty, production status etc. )

Delivery Mode: UPS, DHL, Fedex, TNT, standard flight & vessel